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Creators/Authors contains: "Shan, Wanliang"

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  1. Free, publicly-accessible full text available May 1, 2025
  2. Free, publicly-accessible full text available March 1, 2025
  3. null (Ed.)
    Fibrillar adhesives composed of fibers with non-circular cross-sections and contacts, including squares and rectangles, offer advantages that include a larger real contact area when arranged in arrays and simplicity in fabrication. However, they typically have a lower adhesion strength compared to circular pillars due to a stress concentration at the corner of the non-circular contact. We investigate the adhesion of composite pillars with circular, square and rectangular cross-sections each consisting of a stiff pillar terminated by a thin compliant layer at the tip. Finite element mechanics modeling is used to assess differences in the stress distribution at the interface for the different geometries and the adhesion strength of different shape pillars is measured in experiments. The composite fibrillar structure results in a favorable stress distribution on the adhered interface that shifts the crack initiation site away from the edge for all of the cross-sectional contact shapes studied. The highest adhesion strength achieved among the square and rectangular composite pillars with various tip layer thicknesses is approximately 65 kPa. This is comparable to the highest strength measured for circular composite pillars and is about 6.5× higher than the adhesion strength of a homogenous square or rectangular pillar. The results suggest that a composite fibrillar adhesive structure with a local stress concentration at a corner can achieve comparable adhesion strength to a fibrillar structure without such local stress concentrations if the magnitude of the corner stress concentrations are sufficiently small such that failure does not initiate near the corners, and the magnitude of the peak interface stress away from the edge and the tip layer thickness are comparable. 
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  4. Abstract

    Controlling adhesion on demand is essential for many manufacturing and assembly processes such as microtransfer printing. Among various strategies, pneumatics‐controlled switchable adhesion is efficient and robust but currently still suffers from challenges in miniaturization and high energy cost. In this paper, a novel way to achieve tunable adhesion using low pressure by inducing sidewall buckling in soft hollow pillars (SHPs) is introduced. It is shown that the dry adhesion of these SHPs can be changed by more than two orders of magnitude (up to 151×) using low activating pressure (≈−10 or ≈20 kPa). Large enough negative pressure triggers sidewall buckling while positive pressure induces sidewall bulging, both of which can significantly change stress distribution at the bottom surface to facilitate crack initiation and reduce adhesion therein. It is shown that a single SHP can be activated by a micropump to manipulate various lightweight objects with different curvatures and surface textures. Here, it is also demonstrated that an array of SHPs can realize selective pick‐and‐place of an array of objects. These demonstrations illustrate the robustness, simplicity, and versatility of these SHPs with highly tunable dry adhesion.

     
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  5. Tunable dry adhesion is a crucial mechanism in compliant manipulation. The gripping force can be controlled by reversibly varying the physical properties (e.g., stiffness) of the composite via external stimuli. The maximal gripping force Fmaxand its tunability depend on, among other factors, the stress distribution on the gripping interface and its fracture dynamics (during detaching), which in turn are determined by the composite microstructure. Here, we present a computational framework for the modeling and design of a class of binary smart composites containing a porous low-melting-point alloy (LMPA) phase and a polymer phase, in order to achieve desirable dynamically tunable dry adhesion. We employ spatial correlation functions to quantify, model, and represent the complex bi-continuous microstructure of the composites, from which a wide spectrum of realistic virtual 3D composite microstructures can be generated using stochastic optimization. A recently developed volume-compensated lattice-particle method is then employed to model the dynamic interfacial fracture process, where the gripper is detached from the object, to compute Fmaxfor different composite microstructures. We focus on the interface defect tuning mechanism for dry adhesion tuning enabled by the composite, and find that for an optimal microstructure among the ones studied here, a tenfold dynamic tuning of Fmaxbefore and after the thermal expansion of the LMPA phase can be achieved. Our computational results can provide valuable guidance for experimental fabrication of the LMPA–polymer composites.

     
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  7. Abstract

    Recently, a novel concept to realize dynamically tunable dry adhesion via subsurface stiffness modulation (SSM) in a composite core–shell structure has been introduced and demonstrated for gripping and release of objects. Here, a variant form of the composite core–shell design is proposed to significantly improve the performance of dynamically tunable dry adhesion in terms of activation time and activation voltage. Specifically, composite pillars with an embedded microfluidic channel filled with a low melting point alloy (LMPA) are fabricated, and the adhesion of the pillars is characterized as a function of LMPA state: either melted or solid. The effects of the thickness and in‐plane pattern of the LMPA channel, as well as the depth at which it is embedded on tunable adhesion are investigated. Experiments show that the effective adhesion strength can be reduced up to 50%, equivalent to a 2× change in dry adhesion when the LMPA is melted. Finite element analysis of the stress distribution change under SSM shows that the experimentally observed tunable adhesion is primarily due to stiffness change close to the interface. In addition, two technology demonstrations of composite pillars picking and releasing objects with fast activation (≈1 s) and low activation voltages (≈1 V) are included.

     
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